主要研究领域
LED封装材料和封装工艺的研究;
先进荧光粉涂覆技术研究;
LED荧光粉的制备、表征及其封装测试。
科研项目
近年来参与的主要科研项目:
湖北省自然科学基金:基于圆片键合的直接白光LED芯片技术研究(批准号:2011CHB009);2012.1-2013.12,参与。
国家自然科学基金项目:大功率LED制造关键科学技术;2009.01-2013.12,参与。
近年来发表的代表性学术论著:
LiangYang,MingxiangChen,ZhichengLv,SiminWang,XiaogangLiu,ShengLiu.PreparationofaYAG:Cephosphorglassbyscreen printingtechnologyanditsapplicationinLED.OpticsLetters,2013,38(13):2240-2243. (SCI)
LiangYang,SiminWang,ZhichengLv,ShengLiu.Colordeviation controllingofphosphorconformalcoatingbyadvancedspraypainting technologyforwhiteLEDs.AppliedOptics,2013,52(10):2075-2079. (SCI)
LiangYang,ZhichengLv,YuanJiaojiao,ShengLiu.EffectsofMF resinandCaCOdiffuserloadedencapsulationonCCTuniformity of the phosphorconvertedLEDs.AppliedOptics,2013. (SCI)
LiangYang,MingxiangChen,ShengLiu.FabricationofGelGlassContainingHighRenderingPhosphorMixtureviaSol-GelProcessforLEDs.IEEEProc.OfECTC,2013,2371-2374.
LiangYang,ZhichengLv,MingxiangChen,ShengLiu.CombinationofTranslucentEu:YAGGlassCeramicwithLEDchip.IEEEProc.OfECTC, 2012,2145-2149.
LiangYang,MingxiangChen,ShanYu,ZhichengLv,ShengLiu.FabricationofYAGGlassCeramicandItsApplicationforLightEmitting Diodes. IEEEProc. of ICEPT-HDP,2012,1463-1466.
LiangYang, MingxiangChen,Shengjun Zhou, ShengLiu. Preparation of Phosphor Glass via Screen Printing Technology and Packaged Performance for LEDs. IEEEProc.ofICEPT-HDP,2012, 1189 - 1192.
Zhicheng Lv, Liang Yang, Jiaojiao Yuan, Jing Fang, Bin Cao, Sheng Liu, Study on Packaging Method Using Silicon Substrate with Cavity and TSV for Light Emitting Diodes, IEEE Transactions on Components, Packaging and Manufacturing Technology. (SCI)
Yu Shan, Yang Liang, Cao Bin, Zheng Huai, Cheng Mingxiang, Liu Sheng. Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging. IEEE Proc. Of ICEPT-HDP, 2011, 1-5.